The new target Honeywell equal channel angular modeling (ECAE) patented technology, it is Honeywell initial target for aluminum and aluminum alloys developed by the advanced production technology.

"Honeywell Electronic Materials has accumulated nearly half a century of experience and expertise in metallurgy," Honeywell target business product director Chris • 拉皮耶特拉 (ChrisLapietra), said: "With the use of these technologies, we continue to develop to help our customers benefit from the product technology, new ECAE copper-manganese alloy target is a good example. "

ECAE process produced using ultra-fine grain size targets have to ensure highly uniform material structure, higher material hardness, less impurity particles. Ordinary standard grain size target is typically between 50-80 microns, while the new ECAE copper-manganese alloy target is below submicron size. Using ECAE technology to produce ultra-fine grain size can effectively avoid semiconductor manufacturers in the use of common backplane design with sputtering target will encounter a sudden drop in voltage problem; the problem will cause the tip of the discharge, the formation of impurity particles affect grain round quality, resulting wafers scrapped and replaced with a new target, causing unnecessary high costs.

Enhanced hardness allows the use of a metal target can be integrated design, so that the target service life extended doubled, lifted from the original 1800 kilowatts to 3600 kilowatts hours hours. Extended life means manufacturers can reduce the demand for targets, save target machine replacement and maintenance time and effort required, all of which contribute to help semiconductor manufacturers to reduce overall production costs.